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October 30, 2007
Organized by the IBM Storage Development Lab in Haifa
Call for Abstracts PDF version for printing (114 KB)
You are cordially invited to participate in a one-day Storage Technology workshop on market trends and future R&D. The workshop will be held on Tuesday, October 30, 2007 at the IBM Labs in Haifa, located on the Haifa University campus, Mount Carmel, Haifa, Israel. This workshop is a part of a two-day System and Storage conference (SYSTOR07) being held at the IBM Haifa labs.
The Storage Technology workshop enables storage professionals from both academia and industry to share their work, exchange ideas, and discuss future market trends. The program will cover the latest developments in storage and take a look at recent innovations.
Topics
Topics of interest include, but are not limited to, the following subjects:
- De-duplication - Solutions for redundant data concerns
- Green systems - Energy efficient storage solutions with no performance degradation
- ILM (Information Life-cycle Management) - From primary storage to archive tape
- Thin provisioning - Efficient utilization of storage space
- CDP and other trends in data protection
- New storage media techniques
- Storage preservation
The workshop will take place in the auditorium (Room L100) of the IBM Labs in Haifa. A detailed agenda and participation information will be distributed at a later date. Lunch and refreshments will be served on both days. Participation is free.
Important Dates
| Final date for submission of abstracts: |
September 10, 2007 |
| Notification of abstract acceptance: |
September 25, 2007 |
| Workshop gathering and presentations: |
October 30, 2007 |
What to Submit
Please send an abstract (up to one page in 11 pt. font) describing your work. The abstract should be in PDF, Postscript, or MS-Word format.
How to Submit
Please submit all abstracts using the web submission system: http://papers.haifa.il.ibm.com/systor07/storage/
Organizing Committee
- Shmuel Vashdi, HDL
- Gitit Bar-El, HDL
- Amir Sasson, HDL
- Marina Shudler, HDL
Please feel free to distribute this invitation to industry colleagues and fellow researchers and developers.
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